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this is information on a product in full production. december 2013 docid025560 rev 1 1/11 HSP061-4M10Y automotive 4-line esd protection for high speed lines datasheet - production data features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 8.7 ghz ? ultralow capacitance: 0.3 pf ? low leakage current: 70 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? thin package: 0.5 mm max. ? rohs compliant ? aec-q101 qualified benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards ? mil-std 883g method 3015-7 class 3b: ?8 kv ? iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? 15 kv (air discharge) ? iso 10605: c = 150 pf, r = 330 ? : ? 8 kv (contact discharge) ? 15 kv (air discharge) ? iso 10605: c = 330 pf, r = 330 ? : ? 8 kv (contact discharge) ? 15 kv (air discharge) ? iso 7637-3: ? pulse 3a: -150 v ? pulse 3b: +100 v applications the HSP061-4M10Y is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? automotive communication buses ? hdmi 1.3 and 1.4 ? lvds ? apix ? digital video interface ? usb 3.0 description the HSP061-4M10Y is a 4-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultralow variation of the capacitance ensures very low influence on signal-skew. the large bandwidth makes the device compatible with 3.4 gbps. the device is packaged in qfn-10l 2.5 x 1 mm with a 500 m pitch, which minimizes the pcb area. qfn-10l package www.st.com
characteristics HSP061-4M10Y 2/11 docid025560 rev 1 1 characteristics figure 1. functional schematic (top view) table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iso 10605: c = 150 pf, r = 330 ? contact discharge air discharge iso 10605: c = 330 pf, r = 330 ? contact discharge air discharge 8 15 8 15 kv t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 70 na v cl clamping voltage ipp = 1 a, 8/20 s 15 v c i/o - i/o capacitance (i/o to i/o) v i/o = 0 v, f = 1 mhz, v osc = 30 mv 0.3 0.4 pf c i/o - gnd capacitance (i/o to gnd) v i/o = 0 v f = 1 mhz, v osc = 30 mv 0.6 0.8 pf f c cut-off frequency -3db 8.7 ghz z diff differential impedance t r = 200 ps (10 - 90%) (1) , z 0 diff = 100 ? 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office. 85 100 115 ? i/o 1 i/o 2 gnd i/o 3 i/o 4 internally not connected gnd internally not connected 1 2 4 5 6 8 9 10 3 7
docid025560 rev 1 3/11 HSP061-4M10Y characteristics 11 figure 2. leakage current versus junction temperature (typical values) figure 3. attenuation versus frequency i r (na) 0,01 0,1 1 10 25 50 75 100 125 150 t j (c) v r =v rm =3v 100k 1m 10m 100m 1g 10g -5 -4 -3 -2 -1 0 s21 (db) f (hz) figure 4. differential impedance (z diff ) (1) figure 5. eye diagram - hdmi mask at 3.4 gbps per channel (1) 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office. tr = 200 ps (10% - 90%) 12.5 /div 250 mv/div 50 ps/div
characteristics HSP061-4M10Y 4/11 docid025560 rev 1 figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 v/div 112 v 27 v 20 v 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl 1 1 2 2 3 3 20 v/div -119 v -16 v -11 v 20 ns/div v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl 1 1 2 2 3 3 figure 8. response to iso 7637-3 (pulse 3a) u s = -150 v figure 9. response to iso 7637-3 (pulse 3b) u s = 100 v 5.00 v/div 500 ma/div 50.0 ns/div 50.0 ns/div 5.00 v/div 500 ma/div 50.0 ns/div 50.0 ns/div
docid025560 rev 1 5/11 HSP061-4M10Y package information 11 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. qfn-10l dimension definitions table 3. qfn-10l dimension values ref dimensions millimeters inches min typ max min typ max a 0.40 0.48 0.50 0.018 0.019 0.020 a1 0.00 0.03 0.05 0.00 0.001 0.002 a2 0.13 0.005 b 0.15 0.20 0.30 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.041 d 2.40 2.50 2.60 0.094 0.098 0.102 e 0.9 1.00 1.10 0.035 0.039 0.043 e 0.50 0.206 l 0.30 0.38 0.425 0.012 0.015 0.017 a a1 a2 pin 1 id l r 0.125 d b1 e b e 1 10 6 5 seating plane
package information HSP061-4M10Y 6/11 docid025560 rev 1 figure 13. qfn-10l tape and reel specification figure 11. footprint recommendations (dimensions in mm) figure 12. marking 0.58 0.50 0.40 0.20 2.20 1.40 h4y dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.00 1.75 3.5 ? 1.55 0.55 1.35 0.25 2.75 h4y h4y h4y
docid025560 rev 1 7/11 HSP061-4M10Y recommendation on pcb assembly 11 3 recommendation on pcb assembly figure 14. recommended stencil window position 3.1 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. stencil window footprint copper thickness: 100 m 200 m 190 m 15 m 15 m 5 m 5 m 15 m 15 m 400 m 380 m 10 m 10 m 550 m 550 m 580 m 580 m
recommendation on pcb assembly HSP061-4M10Y 8/11 docid025560 rev 1 3.2 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead rec ognition capabilities of th e placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.3 pcb design 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks a nd open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. figure 15. printed circuit board layout recommendations via to gnd via to gnd 500 m footprint pad pcb tracks 1 5 6 10
docid025560 rev 1 9/11 HSP061-4M10Y recommendation on pcb assembly 11 3.4 reflow profile figure 16. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j-std-020. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information HSP061-4M10Y 10/11 docid025560 rev 1 4 ordering information figure 17. ordering information scheme 5 revision history table 4. ordering information order code marking package weight base qty delivery mode HSP061-4M10Y h4y qfn-10l 3.27 mg 3000 tape and reel hsp 06 1 - 4 m10 y high speed line protection breakdown voltage version number of lines package qfn-10l automotive table 5. document revision history date revision changes 9-dec-2013 1 initial release.
docid025560 rev 1 11/11 HSP061-4M10Y 11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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